Frequently Asked Questions - What is sputtering?
Frequently Asked Questions - What is sputtering?
Sputtering is a form of thin film deposition that occurs in a vacuum system. It utilizes an instrument called a magnetron sputtering source, which uses the glow discharge process and deposits the film on a substrate (sample). After reducing the pressure in a vacuum chamber to as low as 10-7 Torr, an inert gas (usually Argon) is admitted while continuously pumping to a steady state pressure of 10-3 Torr. A high potential is placed on the sputerring source which strikes a plasma though the inert gas to ground. Inert gas molecules are then ionized and accelerate toward the sputtering source. The source is fitted with a material (target) that the user wants to use as the deposition material. When the gas molecule strikes the target attached to the source, one or more molecules of target material are dislodged and travel at low energy by line of sight through the chamber. The target material strikes and adheres to the substrate. For more information follow the link below: http://www.lesker.com/newweb/Deposition_Sources/TechNotes_Sputtering.cfm#WhatIsSputtering
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Category: Systems
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Related Topics: Deposition Techniques, Sputtering, Deposition Rate, Uniformity, Adhesion
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Solved III. Short Answer Questions-Sputtering (22 points) 1.
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:III. Short Answer Questions-Sputtering (22 points) 1. (6 points) Explain why metal can be deposited by DC sputtering and why insulator can't be deposited by DC sputtering, but it can be deposited by RF sputtering? 2. (4 points) Which sputtering (DC sputtering, RF sputtering, reactive sputtering ) you will use to deposit SiO2 and explain why? 3. (6 points) according to the following figure, explain and describe Sputter Deposition INERT GAS TARGETI-) PLASMA © O POWER SUPPLY 000 SUBSTRATE VACUUM CHAMBER AT PARTIAL VACUUM VACUUM PUMPS Figure 1: Sputtering Vacuum Deposition Process
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