Tantalum Sputtering Target Plates

Critical to the architecture of microchips for the high-growth semiconductor industry, Materion manufactures high-purity tantalum target plates used to sputter microscopic thin layers of tantalum on silicon wafers. This enables the manufacturing of next-generation semiconductor logic chips, including DRAM and 3D-NAND memory chips, with advanced node architectures and higher performance.

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LEADING PROPERTIES OPTIMIZE YOUR PVD PROCESS

Our decades of expertise in high-volume production of texture-controlled tantalum for sputtering targets resulted in manufacturing disks with exceptionally consistent properties, enabling end-users to benefit from:

• Chemistry control to parts per billion
• High-quality deposited films (uniform thickness, resistivity)
• Customized deposition rates for optimal sputtering performance

Materion's reliable, consistent, and proven methods have allowed us to remain a leading US-based manufacturer, supplying tens of thousands of advanced texture-controlled plates to the semiconductor industry for consistent and rate-controlled deposition.

TANTALUM MATERIALS

We are a leading global supplier of tantalum materials for a wide range of applications, including logic, memory, RF & power devices, and hard disk drives, that require extreme purity (> 99.995%) with chemical and metallurgical uniformity to enable optimal performance for physical vapor deposition rates and consistency. Our tantalum is available in a variety of forms, including advanced texture-controlled plates, sputtering targets, coils, and pots.

In addition to industry-leading materials, our R&D scientists and engineers continuously partner with customers to develop custom solutions to solve their unique needs and challenges. In addition to our tantalum materials, we offer our customers access to world-class, in-house laboratories and the most comprehensive analytical testing available.

When it comes to thin film deposition techniques like sputtering, the choice of sputtering target material is crucial. Each material brings its unique properties and advantages to the table, making it suitable for specific applications. Let&#;s explore five different types of sputtering targets, highlighting their characteristics and common uses:

Chromium Sputtering Target

Material Characteristics: Chromium (Cr): Known for their excellent corrosion resistance and hardness. They form a protective oxide layer when exposed to air, making them ideal for applications requiring durability and resistance to wear.

Common Uses: Chromium sputtering targets are often used in the aerospace and automotive industries to create protective coatings on components, such as engine parts and decorative trim.

Tantalum Sputtering Target

Material Characteristics: Tantalum (Ta) sputtering targets are valued for their high melting point and excellent conductivity. They are also highly resistant to corrosion and have low vapor pressure, making them suitable for high-temperature applications.

With competitive price and timely delivery, Advanced Targets sincerely hope to be your supplier and partner.

Common Uses: Tantalum sputtering targets find their place in the electronics industry, where they are used to create thin films for capacitors and semiconductors.

Gold Sputtering Target

Material Characteristics: Gold (Au): Renowned for their superior electrical conductivity and optical properties. They have excellent reflectivity in the visible and infrared spectra.

Common Uses: Gold sputtering targets are used in various industries, including electronics, aerospace, and optics, for applications such as producing conductive coatings, reflective layers, and decorative finishes.

Copper Sputtering Target

Material Characteristics: Copper (Cu): Highly conductive and have good adhesion properties. They are also known for their thermal conductivity and are relatively easy to work with.

Common Uses: Copper sputtering targets are widely used in the semiconductor industry to create interconnects and circuitry on integrated circuits (ICs) and printed circuit boards (PCBs).

Tungsten Sputtering Target

Material Characteristics: Tungsten (W): Boasts an extremely high melting point, excellent mechanical strength, and low vapor pressure. They are ideal for applications that require resistance to high temperatures and wear.

Common Uses: Tungsten sputtering targets are crucial in the aerospace, automotive, and solar industries for depositing films that provide thermal protection and durability, as well as in creating high-temperature superconductors.

Shop R.D. Mathis Company&#;s Collection

R.D. Mathis Company&#;s target materials are known for their high purity, precise composition, and consistency, ensuring optimal performance and reliability in thin film coating processes.

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